In a wafer vacuum transfer system, XIVI’s vacuum wafer handling robot adopts a fully linked arm mechanism to achieve high positioning accuracy. With full closed-loop servo control and a vacuum direct-drive motor (DDM), it delivers superior rotational accuracy and faster dynamic response. The bidirectional dual-arm configuration provides extended reach without increasing the process chamber footprint, enabling higher throughput for multi-station wafer handling.
For high-vacuum wafer transfer applications where verified accuracy and repeatability are required, XIVI’s vacuum wafer handling robot offers high positioning repeatability and highly reliable vacuum partition performance.
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Specifications |
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Wafer Size |
6” /8” / 10” /12” |
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Stroke/Range |
Z axis Stroke (Lift) |
70 mm / 125 mm |
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T axis Rotation |
360° continuous |
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R axis Stroke (Extension) |
1050 mm (dependent on end-effector) |
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Repeatability |
Z axis |
±0.05 mm |
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T axis |
±0.006° |
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R axis |
±0.05 mm |
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Weight |
38 kg |
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Vacuum Compatibility |
1 × 10⁻⁶ Pa |
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Helium Leak Rate |
< 1 × 10⁻⁹ std·cc/s He |
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Cleanliness |
ISO Class 1 |
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Communication |
TCP/IP |
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Option |
AWC (Wafer Position Compensation) |
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