The atmospheric wafer transfer robot (hereafter “robot”) is designed for cleanroom operation and consists of a base, an arm, and an optional wafer end-effector (wafer fork). It transfers wafers using vacuum suction and/or clamping, driven by coordinated joint motions, including Z-axis lift, T-axis rotation, and R/W-axis extension/retraction.
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Specifications |
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VTR |
Single-Arm |
Dual-Arm |
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143 mm / 176 mm |
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Rated Payload |
0.5 kg |
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R/W axis |
Speed |
430 mm/s |
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T axis |
Range |
0° ~ 340° |
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T axis |
Angular Speed |
250 °/s |
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Z axis |
Stroke |
250 / 300 / 350 / 400 / 450 mm |
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Z axis |
Speed |
250 mm/s |
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Robot Weight |
< 35 kg |
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Cleanliness |
Class 1 |
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Repeatability |
±0.1 mm |
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Power Requirement |
Single phase AC 200V, 20A |
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*The payload is the weight of the product being transferred.