A 5-axis semiconductor wafer handling robot featuring two independently controlled rotary arms. It supports wafer pick-and-place in EFEM systems with 2 to 3 FOUP load ports. The robot offers high precision and high stiffness.
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Specifications |
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STR |
Single-Arm |
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440 mm |
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Rated Payload |
0.5 kg |
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R axis |
Speed |
350 °/s |
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Range |
−130° ~ +310° |
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θ1 axis |
Speed |
260 °/s |
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Range |
±165° |
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θ2 axis |
Speed |
330 °/s |
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Range |
±165° |
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Z axis |
Speed |
550 mm/s |
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Range |
480 mm |
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Robot Weight |
76-80 kg |
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Cleanliness |
Class 1 |
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Repeatability |
±0.05 mm |
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Power Requirement |
Single phase AC 200V, 20A |
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*Rated payload refers to the weight of the wafer being transferred.